Hong Kong Monetary Authority to Launch Pilot Bond Grant Scheme
On 10 May 2018, the Hong Kong Monetary Authority (HKMA) issued a circular[1] setting out details of the highly anticipated three-year Pilot Bond Grant Scheme (Bond Grant Scheme) announced in the 2018-2019 Budget. The aim of the scheme is to encourage Hong Kong, Mainland and overseas enterprises to issue bonds in Hong Kong. Read more…
